Simulation of a conjugate heat transfer problem using ANSYS Fluent
In this tutorial, we provide guidelines for modeling and simulation of a conjugate heat transfer problem. The simulations presented in this tutorial can be used in designing heat exchangers, HVAC, and electronic components. Here, we model an electronic chip mounted on a flat circuit board. Laminar stream of air (over the board and the chip) cools the solid components and get hotter as it absorbs heat. Complex flow field also causes the thermal energy to be transported.
You will also learn how to do the following through this tutorial:
- Selecting suitable boundary conditions for a conjugate heat transfer simulation
- Using source terms for specified zones
- Using various materials and conducting flow and energy calculations for each of them
- Employ mesh adaption registers and perform Boolean operations on them
- Also, conduct mesh adaption and verify that the solution is mesh-independent
Problem Description of Conjugate Heat Transfer Modeling
As mentioned, the temperature of the air increases as it flows over the chips and the board. In reality, we have a series of heat-generating electronic chips. However, considering the symmetry of the configuration, our model extends from one chip to the plane of symmetry between it and the next chip. Each half chip generates 1 Watt and has a thermal conductivity of 1.0 W/m-K. The circuit board conductivity is 0.1 W/m-K. Air comes into the system at 298 K with a velocity of 0.5 m/s. The flow is laminar since the inlet Reynolds number (based on the spacing between the upper and lower walls) is approximately 870.
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