Introduction (electronics cooling simulation)
We aim to study electronics cooling simulation. Heat transfer is one the phenomena occurring in many important industrial processes whether we need to add heat or remove heat from the systems. One of the areas in which we need to remove the heat is electronics cooling. Here, we study electronics cooling in the presence of conduction, convection, and radiation. In this tutorial, you will learn how to model heat transfer of hot electronic components attached to a printed circuit board (PCB). The connection is conducted via a heat finned sink. PCB is in an environment that is open above and below.
Steps in electronics cooling simulation
Consider a mesh and investigate it in terms of size and quality. Then, set the boundary conditions and specify solver settings. For the simulation, you must enable the energy equation. Then, you should modify the materials for solids and air. At first, only heat conduction and convection are modeled. The next step is modeling the effect of thermal radiation. Finally, you can study the results using temperature contours and other plots.
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