Electroplating, ANSYS Fluent CFD Simulation

Description

Description

In this project, we present the CFD simulation of the Electroplating using ANSYS Fluent software.

Electroplating is the plating process of one metal onto another by hydrolysis, most commonly to prevent metal corrosion. In other words, during an electroplating process, a thin layer of one metal is coated on another metal through electrochemical reactions.

The electroplating reactor consists of anode and cathode plates placed in an electrolyte solution and connected to a direct current source.

The electroplating process consists of two electrochemical reactions. These reactions involve ion species (electric current).

First, in the anodic reaction, solid copper is decomposed into copper ions and electrons. It means that copper is oxidized so that copper ions are transferred from the anode to the cathode plate through the electrolyte. Then, in the cathodic reaction, copper ions are converted into copper metal. It means that copper is regenerated so that it is deposited on the cathode plate.

Methodology

First, we modeled the electroplating reactor geometry in Design Modeler software. Then, we meshed the model using ANSYS Meshing software, and 89115 elements were generated. Finally, we simulated the electroplating process in ANSYS Fluent software.

In the electroplating system, electrochemical reactions occur. Therefore, we used the Species Transport model. Then, we defined the corresponding reactions in volumetric and electrochemical states.

For electrochemical reactions, we need to apply a potential to the anode and cathode. So, we used the Potential/Electrochemistry model to enable the potential equation.

Since the electroplating process occurs over time, we run the calculation in an unsteady state (transient).

Conclusion

First, we obtain the contours of the corrosion rate and accumulated corrosion rate. Then, according to the surface area, we obtain the deposition rate contour, and according to the density, we obtain the deposition thickness contour.

The results show that on the cathode side, the corrosion rate is negative, the deposition rate is positive, and a deposited layer has formed on the cathode plate. So, we conclude that the present electroplating system is operating properly.