Microchannel Heat Sink for Heat Transfer Enhancement
$120.00 Student Discount
- The problem numerically simulates the heat transfer of water flow inside a microchannel heat sink using ANSYS Fluent software.
- We design the 3-D model with the Design Modeler software.
- We mesh the model with ANSYS Meshing software.
- The mesh type is Structured, and the element number equals 1500000.
- The Energy Equation is activated to consider heat transfer.
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Description
Microchannel Heat Sink, Heat Transfer Enhancement, ANSYS Fluent Training
The present problem simulates the heat transfer of water flow inside a microchannel heat sink using ANSYS Fluent software.
One of the serious problems in designing electronic equipment due to its small structure is eliminating the generated heat. This simulation investigates the thermal performance of a cylindrical microchannel heat sink for electronic equipment cooling.
This thermal sink consists of 86 microchannels with a rectangular cross-section with a hydraulic diameter of 560 micrometers around the cylindrical geometry. Water flows at a rate of 0.59 m/s, and a temperature of 297 K enters the microchannel duct.
The present model is designed in three dimensions using Design Modeler software. The model is related to a cylindrical heat sink with a microchannel. The internal radius of the model is equal to 5 mm, and its thickness is equal to 10 mm.
Due to the symmetrical structure of the geometry, only one segment of it is designed, and the periodic boundary condition is used.
We carry out the model’s meshing using ANSYS Meshing software. The mesh type is structured. The element number is 1500000.
Microchannel Methodology
The model’s central core is considered a heat source; thus, the model’s inner wall is assumed to have a constant flux boundary condition equal to 243507 W/m2.
Microchannel Heat Sink for Heat Transfer Enhancement Conclusion
At the end of the solution process, three-dimensional contours related to pressure, temperature, and velocity are obtained. These three-dimensional contours are related to the interior of the microchannel. Also, the two-dimensional temperature contour is obtained in three sections of the model.
It includes the flow of fluid inside the microchannel and the solid part of the model. It should be noted that this simulation is performed only for one segment of the model and with the periodic boundary condition.
Therefore, at the end of the work, the segment is rotated around a central axis so that the contours can be formed in three dimensions. Temperature counters show well that the solid part of the model has decreased in temperature, resulting in the cooling process.
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