Immersion Cooling Effect on Heat sinks’ Performance CFD Simulation

$60.00 Student Discount

  • This project simulates the effect of immersion cooling on heat sinks’ performance in ANSYS Fluent software.
  • The 3D model is designed using the Spaceclaim, then meshed using ANSYS Meshing  producing 85,000 cells.
  • The k-epsilon RNG turbulence model is employed to accurately predict flow patterns.
Click on Add To Cart and obtain the Geometry file, Mesh file, and a Comprehensive ANSYS Fluent Training Video.

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Special Offers For Single Product

If you need the Geometry designing and Mesh generation training video for one product, you can choose this option.
If you need expert consultation through the training video, this option gives you 1-hour technical support.
The journal file in ANSYS Fluent is used to record and automate simulations for repeatability and batch processing.
editable geometry and mesh allows users to create and modify geometry and mesh to define the computational domain for simulations.
The case and data files in ANSYS Fluent store the simulation setup and results, respectively, for analysis and post-processing.
Geometry, Mesh, and CFD Simulation methodologygy explanation, result analysis and conclusion
The MR CFD certification can be a valuable addition to a student resume, and passing the interactive test can demonstrate a strong understanding of CFD simulation principles and techniques related to this product.
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If you want training in any language other than English, we can provide you with a subtitled video in your language.



In this project, we want to study the effect of immersion cooling on heat sinks’ performance in ANSYS Fluent software. In these systems, chipsets are drenched in water or any conductive liquid instead of air. In the present problem, water is the working fluid in our immersion cooling system.
The 3D model is designed using the Spaceclaim. A rectangular case in which chipsets are installed on the side wall. Then, a structured mesh grid is performed using ANSYS Meshing software (85000 cells).


Firstly, to solve the energy equation, we must activate it. Plus, the k-epsilon RNG turbulence model is employed to accurately predict flow patterns during the motion. Next, a 100 w/m2 heat flux is applied to all 9 chipsets, which can drastically increase the temperature. This is why we are aiming to use an immersion cooling system.


After the solution, 2D and 3D contours were displayed. It is worth mentioning that the inlet velocity for air and water is the same (0.1m/s). However, the flow patterns are entirely different. As shown in the attached figures, the air can reach higher parts of the case before leaving through the outlet, resulting in longer contact with hot surfaces. This can be beneficial and all 9 chipsets experience a temperature downfall. However, the water circulation is different, and it cannot make full contact with all 9 chipsets, just the bottom row. Still, the results show that using an immersion cooling system is more efficient. To sum up, the heat sink`s surface average temperature reaches 335.26K, which can cause damage, but considering the immersion system, it results in 283.53K. Remember that the initial temperature of air and water was 283K in both cases.


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