Microchannel Heat Source CFD Simulation
In this project, fluid flows in a microchannel surrounded with copper channel considering a heat flux wall is simulated.
This product includes Mesh file and a Training Movie.
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In this project, fluid flows in a microchannel which is surrounded with copper solid channel, having a heat flux wall. Electronical devices which have millimeter dimensions are in constant need of cooling due to their high heat generation rate. Macro heat exchangers and radiators are not efficient enough to cool down these devices which generate heat at megawatts per meter square. Periodic boundary condition is used to simulate microchannel real geometry at lowest computational cost. Heat flux on microchannel wall is equal to 243507.0629 W/m2. This heat flux increases the fluid temperature from 297 k on inlet to 304.64 k on outlet.
Microchannel Geometry and mesh
Geometry of fluid domain is designed in Design modeler and computational grid is generated using Ansys meshing. Mesh type is structured and element number is 1500000.
Heat Source Solver configuration
- Solver type is assumed Pressure Based.
- Time formulation is assumed Steady.
- Gravity effects is neglected.
The following table a summary of the defining steps of the problem and its solution.
|Fluid||Definition method||Fluent Database|
|Cell zone conditions (microchannel)|
|Boundary conditions (microchannel)|
|Velocity magnitude||0.59 m/s|
|Heat flux||243507.0629 W/m2|
|Solver configurations (microchannel)|
|Spatial discretization||Gradient||Least square cell-based|
|Momentum||Second order Upwind|
|Energy||Second order Upwind|
Results and discussion
Water flow average temperature at inlet and outlet boundaries is 297 and 304.67 k, respectively.
There is a mesh file in this product. By the way, the Training File presents how to solve the problem and extract all desired results.