Microchannel Heat Source CFD Simulation, ANSYS Fluent Tutorial

$120.00 Student Discount

  • The problem numerically simulates the Microchannel Heat Source using ANSYS Fluent software.
  • We design the 3-D model by the Design Modeler software.
  • We mesh the model with ANSYS Meshing software.
  • The mesh type is Structured, and the element number equals 1500000.
  • The Energy Equation is activated to consider heat transfer.

Special Offers For Single Product

If you need the Geometry designing and Mesh generation training video for one product, you can choose this option.
If you need expert consultation through the training video, this option gives you 1-hour technical support.
The journal file in ANSYS Fluent is used to record and automate simulations for repeatability and batch processing.
editable geometry and mesh allows users to create and modify geometry and mesh to define the computational domain for simulations.
The case and data files in ANSYS Fluent store the simulation setup and results, respectively, for analysis and post-processing.
Geometry, Mesh, and CFD Simulation methodologygy explanation, result analysis and conclusion
The MR CFD certification can be a valuable addition to a student resume, and passing the interactive test can demonstrate a strong understanding of CFD simulation principles and techniques related to this product.



In this project, ANSYS Fluent software simulates fluid flow in a microchannel surrounded by a solid copper channel, which has a heat flux wall. We perform this CFD project and investigate it by CFD analysis.

The present model is designed in three dimensions using Design Modeler software. The meshing of the model has been done using ANSYS Meshing software. The mesh type is Structured, and the element number is 1500000.

Microchannel Methodology

Electronic devices with millimeter dimensions constantly need cooling due to their high heat generation rate. Macro heat exchangers and radiators are not efficient enough to cool down these devices, generating heat at megawatts per square meter.

The periodic boundary condition simulates real microchannel geometry at the lowest computational cost. Heat flux on the microchannel wall is equal to 243507.0629 W/m2.

The water flow enters the inlet boundary with a velocity of 0.59 m.s-1 and a temperature of 297K and leaves the computational domain through a pressure outlet boundary. The laminar model and energy equation are enabled to solve fluid equations and calculate temperature distribution, respectively.

Microchannel Conclusion

Finally, the contours related to pressure, velocity, temperature, and velocity vectors are obtained. As is seen in the temperature contour, the water flow has reduced the microchannel temperature indicating its ability to cool down electronic devices.

The heat flux absorbed by the water flow causes its temperature to increase from 297 k on the inlet to 304.64 k on the outlet.


  1. Justina Yundt

    Can this simulation be used for academic research?

    • MR CFD Support

      Absolutely. Our simulations can be a valuable tool for academic research in fields such as heat transfer and fluid dynamics.

  2. Mohammed McClure

    How can I purchase this simulation?

    • MR CFD Support

      You can purchase our simulations directly from our website, http://www.MR-CFD.com. If you have any questions or need assistance, please feel free to contact us.

  3. Shirley Hamill

    What kind of post-processing options are available for analyzing the simulation results?

    • MR CFD Support

      The post-processing options include the visualization of temperature and velocity fields, as well as the calculation of heat transfer coefficients and pressure drops.

Leave a customer review

Your email address will not be published. Required fields are marked *

Back To Top
Whatsapp Call On WhatsApp